ENTRON-EXX – PVD Solutions
The Entron-EXX multi-chamber sputtering system is specifically for the 300mm Silicon Semiconductor market. Entron system is equipped with the latest process chambers for advanced 300mm processing
- Single to Tandem Core Platform
- High Performance
- High Reliability
- High Flexibiliy
FURTHER APPLICATIONS
- Flexible module configuration
- System can run both PVD and CVD/ALD process
- Many applications including: (NVM, Al & Cu wiring, TI/TiN barrier metal, thick AL and Co/Ni salicide etc.)
- Process capability for not only Si devices but also compound semiconductor
- 10 process modules maximum
- Single or Tandem platforms are available
- High Throughput system with great reliability
- Highly reliable Rorze EFEM used for atmospheric transfer
- Equipped with the latest control system that complies with the next generation semiconductor Fab
- Semi Compliant



