• Products • Equipment • By Application • LED Device • Load-Lock-type High Vacuum Evaporation System CV-Series
- COMPONENTS
- Vacuum Pumps
- Dry Pumps
- Screw Type Dry Vacuum Pump LS Series 120A
- Dry Vacuum Pump MS Series
- Scroll Type Dry Vacuum Pumps DIS Series
- Scroll Type Dry Vacuum Pumps DISL Series
- Diaphragm Type Dry Vacuum Pump DTC Series
- Diaphragm Type Dry Vacuum Pump DAU-20/DTU-20
- Diaphragm Type Dry Vacuum Pump DA Series
- Diaphragm Type Dry Vacuum Pump DAP Series
- Dry Vacuum Pump CR Series
- Dry Vacuum Pump LR/HR/UR Series
- Dry Vacuum Pump CR Series Version B
- Dry Vacuum Pump GR Series
- Rocking Piston Type Dry Vacuum Pumps DOP Series
- Oil Rotary Pumps
- Mechanical Booster Pumps
- Ion Pumps
- Turbo Molecular Pumps
- Oil Diffusion Pumps
- Cryo Pumps
- Accessories
- Dry Pumps
- Vacuum Gauges
- G-TRAN Series Pressure Switch Unit (SAU)
- Ceramic Capacitance Manometer, CCMT-D Series
- Extreme High Vacuum Gauge AxTRAN
- G-TRAN Series Pirani Gauge Sensor Unit SP1
- Atmospheric Pirani Gauge Combo SW1 & ISG1
- G-TRAN Series 4CH Display Unit IM1R1, IM2R1
- Cold Cathode Gauge Sensor Unit G-Tran Series SC1
- Multi Ionization Gauge G-TRAN Series ST2-1, ST2-2
- Smartphone-Direct Pirani Gauge SWU10-U
- Process Gas Monitor
- Leak Detectors
- Thin Film Measurement / Deposition Controller
- Vacuum Valves
- Power Generator
- Molecular Interaction Analyzer
- Thermal Analysis
- Vacuum Pumps
- Equipment
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- Medium Current Ion Implanter SOPHI-400
- Activation Annealing System Ailesic-2000
- Oxidation-Nitridization-Annealing System Ailesic 1400-1700
- High-temp Ion Implanter for SiC IH-860PSIC
- Medium Current Ion Implanter SOPHI-200/260
- Dry Etching System for Production NE-5700 & NE-7800
- Load-lock-type Plasma CVD System CC-200/400 PD
- Back Side Metallization Sputtering System SRH-530 pd
- R&D Equipment for Displays
- Semiconductor Process (FEOL/BEOL)
- Semiconductor Process (Non Volatile Memory)
- Thin Film Deposition
- Thin Film Battery
- Touch Panel
Load-Lock-type High Vacuum Evaporation System CV-Series
CV-200 consists of two chambers; a load-lock chamber and an evaporation chamber. Employing the load-lock type system enables the process to be carried out in a constantly clean environment. It also provides superior film repeatability. Application ranges from R&D use to small production.
- Load-lock type system to support high vacuum processes.
- Supports various substrate sizes.
- Supports substrate holder transfer.
- Supports lift-off deposition (standard; φ4 inch, option; up to φ6).
- Supports various evaporation sources (i.e. EB,RH, etc.).
- Supports high temperature heating (maximum of 450ºC).
- Vacuum box-enabled indirect sequential processing within C-series (Sputter: CS-200, P-CVD: CC-200, Polymerizing evaporation: CP-200).
SPECIAL FEATURES / FURTHER APPLICATIONS
- Power devices.
- Compound-related devices of LED, LD and high speed devices.
- Organic EL material system for R&D use.
- Oxide evaporation of liquid crystal alignment layers.
